CSP 5020 is suitable for a range of technical nodes, including logic circuits, memory, and other metal interconnect layer polishing

Higher removal rate can greatly improve CMP production capacity

Excellent copper removal performance and barrier layer selectivity

Adjustable butterfly shape and erosion defects

Low surface defects and residues

High planarization efficiency, low morphology, and good copper cleaning effect

The formula is highly concentrated and cost-effective

The formula has adjustability and can meet the specific performance needs of customers